Japan will pump $20 billion in funding into two new semiconductor facilities in the US as part of a trade agreement between the two countries, with GlobalFoundries selected to operate the sites.

The move forms part of a wider trade deal between the countries for Japan to invest $550 billion in return for the US lowering tariffs of Japanese goods.

GlobalFoundries will build the new sites at its Malta, New York, campus with the initiative designed to accelerate trusted semiconductor manufacturing in the US, strengthen critical supply chains and support growing demand across automotive, industrial and connected infrastructure markets.

Japan will make an initial investment of approximately $10 billion, accelerating construction of a new 300mm semiconductor fab which is expected to come online in 2029. It will add approximately 900,000 wafers of annual manufacturing capacity when fully operational.

An additional $10 billion will fund a second fab, which will produce the same amount of wafers. The entire project is expected to create about 27,000 construction and ecosystem jobs and more than 1,000 highly skilled manufacturing jobs in New York’s Capital Region.

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GlobalFoundries has also agreed a deal with the US Commerce Department to amend an existing award under the CHIPS and Science Act to reallocate $995 million towards investments in silicon photonics and other areas. This will expand manufacturing capacity for technologies “increasingly critical to communications infrastructure and data centres”.

As part of a separate arrangement, the US government will receive approximately 4% equity in GlobalFoundries, taking its total stake to 7%.

Tom Breen, CEO of GlobalFoundries said the initiative was a bold new step for semiconductor manufacturing, bringing together the US and Japan with differentiated technology and decades of manufacturing expertise.

Howard Lutnick, US secretary of commerce added President Donald Trump’s historic US, Japan trade deal “is delivering another massive manufacturing investment into America”.

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NTT Docomo and US-based network equipment manufacturer Abside Networks signed an agreement to explore next-generation, AI-driven networks using high-altitude platform stations (HAPS), as operators look to extend networks beyond terrestrial infrastructure.

Under the memorandum of understanding (MoU), the pair will collaborate on HAPS system architecture, network control and data utilisation. They will also examine how AI can forecast demand and manage radio beams, capacity, spectrum and interference in stratospheric RAN.

In addition, the partners plan to study the collection and use of data on network quality, operations and stratospheric sensing, as well as potential integration with external applications and service platforms.

The agreement supports NTT Docomo’s broader vision for a “three-dimensional communications infrastructure that integrates AI with non-terrestrial network (NTN) initiatives, including HAPS”. Operating at altitudes of around 20km, HAPS use unmanned platforms to provide wide-area connectivity, including to underserved locations where conventional mobile coverage is difficult or uneconomical, such as mountainous regions and maritime areas.

The Japanese operator explained it aims to integrate terrestrial networks with systems in the stratosphere and space to enable wider-area, higher-capacity services that address mounting connectivity demand as AI usage balloons.

NTT Docomo has been conducting research and demonstrations aimed at delivering HAPS-based communications services, but noted the stratospheric environment requires specialised RAN technologies and equipment.

As a result, Abside is developing radio systems based on large antenna arrays for precise beam control, alongside an AI-driven software platform designed to provide “integrated control of networks across the ground, stratosphere and space”.

The equipment manufacturer also brings experience in stratospheric communications through its work on Google’s Project Loon balloon initiative, alongside development of HAPS equipment, NTN technologies and AI-based network control systems.

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