Samsung reportedly raised prices across most of its flagship Galaxy S26 range as a global memory shortage pushed component costs up.

Bloomberg reported prices for the Galaxy S26, S26+ and flagship S26 Ultra increased by $100 each, taking starting figures to $1,000, $1,200, and $1,400.

The high-end 1TB S26 Ultra now starts at $2,000, up $200, Bloomberg wrote.

Demand for high-bandwidth memory used in AI infrastructure and data centres has tightened supplies of DRAM and mobile memory chips over the past year, increasing the bill-of-materials for smartphones, PCs and games consoles.

Bloomberg noted Apple’s iPhone 18 Pro range is more costly than previous editions and the vendor recently raised prices for some older models.

It highlighted Google’s Pixel 11 devices are also pricier than their predecessors.

Bloomberg noted the price of Samsung’s entry-level Galaxy S26 FE remains at the $700 set at its launch in August. The fee is $50 higher than the comparable previous model.

The news outlet highlighted Samsung held the prices of its Galaxy Z Fold 8, Z Fold 8 Ultra and Z Flip 8.

Bloomberg also flagged the $1,900 price tag on the Galaxy Z Fold 8 as being less than the $1,999 price Apple plans to charge for its iPhone Duo, which is scheduled to launch on 23 October.

The post Samsung ups S26 prices as memory crunch bites appeared first on Mobile World Live.

Huawei unveiled its Mate 90 smartphone series with a spotlight on its latest in-house chip architecture, amid continued US curbs on advanced semiconductor shipments.

The Mate 90 range comprises four models running on Huawei’s HarmonyOS 7, which the company said supports more than 450,000 apps and services. Pricing starts at CNY5,999 ($895) for the base Mate 90, with the top end Mate 90 RS Ultimate Design reaching CNY12,999.

The premium models use Huawei’s Kirin 9050 Pro chipset, which the vendor claimed delivers a 31% performance boost compared with the previous generation. The chip also integrates Huawei’s LogicFolding technology, which restructures chip wiring vertically to enable denser processing, shorter critical paths and reduced latency.

Price hikes
In a briefing, Huawei executive director and consumer business chief Richard Yu explained the Chinese vendor developed the technology in response to restrictions on advanced semiconductor manufacturing.

“Our LogicFolding technology is just an approach we adopt to improve our capabilities when our access to certain technology is restricted,” he said.

“Currently, the production capacity for advanced semiconductors in China is indeed limited,” Yu noted, adding semiconductor and smartphone production capacity “remains tight” due to the “sharp price increase for memory components over the past two years”.

To that end, he revealed component price hikes had added more than $200 to the cost of each handset, while Huawei’s margins were coming under pressure. “Moving forward, we will have to increase our prices, too,” he concluded.

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